Offer Details

Enquiry No. : 8031639 Chonburi (Thailand)

Description :Good day,
We've got to know that your esteemed company is dealing in such
several silicon materials as Silicon Ingot Bricks, IC grade Pot scrap
Tail & Tail, IC grade wafer, IC grade broken wafer etc..., and we would
like to know if your esteemed company still have these materials and can
supply the same regularly as well. And also we would like know the
origin of these material. Kindly let us receive your reply to these.

And if A M products are still available, kindly let us receive your
best offer for the same so we can check out and purchase
if everything is okay

Looking forward to establishing the good business relationship with your
esteemed company, your prompt reply will be highly appreciated.
Thanks and regards,

1. Mono silicon wafers,
Dimension: (125+/-0.5)x(125+/-0.5)x(150+/-0,5) mm,
P-type, Boron doped,
Resistivity : 0.5 -3.0 Ohm-cm,
Life time : >10 �s,
Thickness: 200+/-40 �m,

2. Mono silicon wafers,
Dimension: (125+/-0.5)x(125+/-0.5)mm cut from diameter 166.2+/-1mm,
N-type, Phosphorus doped,
Resistivity : 0.5 -3.5 Ohm-cm,
Orientation <100>+/-3 degree,
Life time : >50�s,
Thickness: 220+/-30�m,
TTV <40�m,
Oxygen content: <1 x 1018 at/cm3,
Carbon content: <5 x 1016 at/cm3,
Surface: cut and cleaned,
Angle between sides: 90+/-0.3 degree,
Depth of saw marks: <20�m,
Edge chips: less than 2 pcs with size <1mm x 0.8mm,
Chips with depth <0.2mm are allowed,
Cracks are not allowed.

3. Multy silicon wafers,
Dimension: (125+/-0.5)x(125+/-0.5)mm,
P-type, Boron doped,
Resistivity : 0.5 2.0 Ohm-cm,
Orientation <100>+/-3 degree,
Life time : >1.5�s,
Thickness: 240+/-30�m,
TTV <40�m,
Oxygen content: <4 x 1017 at/cm3,
Carbon content: <5 x 1017 at/cm3,
Surface: cut and cleaned,
Angle between sides: 90+/-0.3 degree,
Depth of saw marks: <20�m,
Corner length 1.4-2.85mm,
Edge chips: less than 2 pcs with depth <0.5mm and width <10mm,
Small chips with length <0.2mm are allowed,
Cracks are not allowed.